The term “lithography” or “process node” of a CPU refers to the size of the transistors and other components that are etched onto the surface of the silicon wafer during the manufacturing process. This is typically measured in nanometers (nm).
As technology advances, manufacturers are able to create smaller and smaller transistors and components, which allows them to pack more functionality onto a single chip. This can result in higher performance and lower power consumption for the same chip area.
For example, a CPU with a 7nm process node means that the smallest feature on the silicon wafer is 7nm in size. The smaller the process node, the more transistors and other components can be packed onto the same surface area, leading to improved performance and energy efficiency.
The process node is a key factor in determining the performance and power consumption of a CPU. As manufacturing technology advances, manufacturers are able to produce CPUs with smaller and more advanced process nodes, which can lead to significant improvements in performance and efficiency.