Description
Gigabyte X570 AORUS PRO WiFi Motherboard with 12+2 Phases IR Digital VRM, Fins-Array Heatsink & Direct Touch Heatpipe, Dual PCIe 4.0 M.2 with Thermal Guards, Intel® WiFi 6 802.11ax, Intel® GbE LAN with cFosSpeed, USB Type-C, RGB Fusion 2.0
- Supports AMD Ryzen™ 5000 Series/ 3rd Gen Ryzen™/ 2nd Gen Ryzen™/ 2nd Gen Ryzen™ with Radeon™ Vega Graphics/ Ryzen™ with Radeon™ Vega Graphics Processors
- Dual Channel ECC/ Non-ECC Unbuffered DDR4, 4 DIMMs
- 12+2 Phases IR Digital VRM Solution with Power Stage
- Advanced Thermal Design with Fins-Array Heatsink and Direct Touch Heatpipe
- Dual Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Dual Thermal Guards
- Intel® WiFi 6 802.11ax 2T2R & BT 5
- ALC1220-VB Enhance 114dB(Rear)/ 110dB(Front) SNR in Microphone with WIMA Audio Capacitors
- Intel® Gigabit LAN with cFosSpeed Internet Accelerator Networking
- RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Supports Addressable LED & RGB LED Strips
- Smart Fan 5 features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
- Front & Rear USB 3.2 Gen2 Type-C™ Header & HDMI 2.0 support
- Integrated I/O Shield Armor
- Q-Flash Plus update BIOS Without Installing CPU, Memory and Graphics card
Specification
- 12+2 Phases IR Digital VRM Solution with PowIRstage
- 6-Layer 2X Copper PCIe 4.0 Mid-Loss Ready PCB
- Intel® WiFi 6 802.11ax 2T2R & BT 5
- HDMI 2.0
- Advanced Thermal Design
- Fins-Array Heatsink
- Direct Touch Heatpipe
- 5 W/mK LAIRD Thermal Conductivity Pad
- Intel® GbE LAN
- cFosSpeed Internet Accelerator
- Integrated I/O Shield
- Q-Flash Plus USB Port
- Rear USB 3.2 Gen2 Type-C™
- Dual PCIe 4.0 x4 M.2 Connectors
- PCIe 4.0/3.0 x4 NVMe support
- Dual Thermal Guards
- Audio Solutions
- ALC1220-VB Audio
- High-End Audio Capacitors (WIMA & Nichicon Fine Gold)
- Supports AMD Ryzen™ Series Processors
- Dual Channel DDR4, 4 DIMMs with Ultra Durable Memory Armor
- Solid Pin Power Connectors
- 24 pin ATX Power Connector
- 8+4 pin CPU Power Connector
- Front USB 3.2 Gen2 Type-C™
- PCIe 4.0 x16/x8/x4/x1 Slots
- 2x Ultra Durable PCIe Armor
- RGB FUSION 2.0
- Addressable LED Header*2
- RGB LED Header*3
GET READY FOR AMD RYZEN™ 3000-SERIES
GIGABYTE X570 motherboards based on the AMD X570 Chipset provide full support for 3rd Gen AMD Ryzen™ Processors. The all-new design is a testament to GIGABYTE’s dedication to design quality. GIGABYTE X570 motherboards offer a rich list of features such as support for PCIe 4.0 and USB Type-C™ interfaces on select boards, refined audio, high speed of Ethernet and latest standard of WIFI design, to fulfill users’ performance, audio, and data transfer needs. The new, advanced power and thermal design enables users to unleash the performance on AMD Ryzen™ 3000-series Processors, making the GIGABYTE X570 motherboards perfect for users looking to build the best AMD platform gaming system.
AMD StoreMI Technology
GIGABYTE X570 motherboards maximize your PC’s potential with AMD StoreMI technology. StoreMI accelerates traditional storage devices to reduce boot times and enhance the overall user experience. This easy-to-use utility combines the speed of SSDs with the high capacity of HDDs into a single drive, enhances the read/write speeds of the device to match that of SSDs, bolsters data performance for incredible value, and transforms the everyday PC to a performance driven system.
The benefits of AMD StoreMI:
• Making the PC experience fast, smooth and easy
• Optimizing computer responsiveness from system boot to application launch
• Offering SSD performance with HDD capacity at an affordable cost
• Quickly accessing key files by automatically learning users’ computing behaviors
Ultimate Power Design
To unleash the full potential of the 3rd Generation of AMD Ryzen™ CPU, the motherboard requires the best CPU power design. With the best quality components and GIGABYTE R&D design capability, the X570 AORUS is a true beast among motherboards.
Advanced Thermal Design
X570 AORUS PRO WIFI reaches a perfect balance between style and performance by combining the media acclaimed Fins-Array heatsink and Direct Touch heatpipe to provide 30% lower MOSFET temperatures for enthusiasts, overclockers and professional gamers
Fins-Array Heatsink with Direct Touch Heatpipe and High Thermal Conductivity Pad
X570 AORUS PRO WIFI uses Fins-Array Heatsink which increases the heat dissipation area by 300% compared to traditional heatsinks of the same size. Direct Touch Heatpipe helps transfer heat from MOS fins. By using LAIRD 1.5mm thick, 5W/mK high thermal conductivity pads, it can transfer 2.7x more heat compared to traditional thermal pads in the same time period.
Smart Chipset Fan Heatsink
Smart Fan
- Provides 3 different operating modes to minimize noise and extend the fan’s longevity. Silent, Balanced and Performance modes, choose the mode that suits you the best in any situation.
High Durability
- X570 motherboards adopt a high quality ball bearing fan which guarantees 60,000* working hours.
Full PCIe 4.0 Design
X570 AORUS pushes the envelope once again by featuring Full PCIe 4.0 Design, including PCIe 4.0 slots, PCIe 4.0 M.2 connectors and delivering highly optimized performance and flexibility demanded for power users and extreme gaming enthusiasts.
Next Generation Connectivity
A high-end product needs to be future-proof so your system stays up-to-date with the latest technology. X570 AORUS motherboards provide all next generation network, storage, and WIFI connectivity to keep you up to speed.
ALC1220-VB Immersive Gaming ViBes
All New Realtek High-End HD Audio Codec
ALC1220 120dB(A) SNR HD Audio with Smart Headphone Amp automatically detects impedance of your head-worn audio device, preventing issues such as low volume and distortion.
With the new VB series audio controller, stream your voice to the world vibrantly with both front/rear microphone SNR up to 110/114dB(A).
With the new VB series audio controller, stream your voice to the world vibrantly with both front/rear microphone SNR up to 110/114dB(A).
High-End WIMA & Audio Capacitors
The AORUS motherboards boast a combination of Hi-Fi grade WIMA FKP2 capacitors and high-end Chemicon audio capacitors. While the high-end audio capacitors are suited for high-grade audio equipment, using state of the art technology to provide rich sound in the bass and clearer high frequencies, the WIMA FKP2 capacitors are being used widely in premium grade Hi-Fi systems. The addition of this to the exclusive AOURS AMP-UP Audio technology makes for the ideal onboard sound solution for the most demanding audiophiles.
RGB Fusion 2.0
With AORUS Motherboards, RGB Fusion 2.0 is even better with Addressable LEDs.* RGB Fusion 2.0 offers users the option to control onboard RGB and external RGB / Addressable LED light strips for their PC. Already feature filled with colors and patterns, RGB Fusion 2.0 on X570 Series AORUS Motherboards are now upgraded with Addressable LED support. With external Addressable LED strips*, where each LED is digitally addressable, users can experience even more patterns, styles, and illuminations.
AORUS Motherboards will support 5v Addressable LED lighting strips and up to 1000 LED lights. RGB Fusion 2.0 with Addressable LEDs comes with new patterns and various speed settings with more to come.
Multi-Zone Light Show Design
Now offering more LED customizations than ever, users can truly adapt their PC to represent their lifestyle. With full RGB support and a redesigned RGB Fusion 2.0 application, the user has complete control over the LEDs which surround the motherboard.
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